Ultraprecise method of aligning 3D semiconductor chips invented.
Researchers at the University of Massachusetts Amherst have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work, published in Nature Communications, can help to lower the cost of producing 2D semiconductor chips, enable 3D photonic and electronic chips, and may pave the way for other low-cost, compact sensors.

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